Description |
- Intel Xeon Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s, CPU1: Skylake-F CPU supported
- Intel C622
- Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
- 4 PCI-E 3.0 x16,
- 2 PCI-E 3.0 x8
- M.2 Interface: PCI-E 3.0 x4
- M.2 Form Factor: 2260, 2280, 22110,
- 2 PCI-E 3.0 NVMExpress x4 Internal Port(s)
- 1 VGA port
- Intel C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
- Dual LAN with 10GBase-T with Intel X722 + X557
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